IEC 60249-3-1:1981

Base materials for printed circuits. Part 3: Special materials used in connection with printed circuits. Specification No. 1: Prepreg for use as bonding sheet material in the fabrication of multilayer printed boards

Covers the bonding sheet material used in the fabrication of multilayer printed boards. The test methods for bonding sheet material are also dealt with.

SDO:

IEC

Language:

English

ICS Codes:

31.180

Status:

Withdrawn

Publish date:

1980-12-31

Standard Number:

IEC 60249-3-1:1981