IEC 61188-1-2:1998

Printed boards and printed board assemblies - Design and use - Part 1-2: Generic requirements - Controlled impedance

The aim in packaging is to transfer a signal from one device to one or more other devices through a conductor. High-speed designs are defined as designs in which the interconnecting properties affect circuit performance and require unique considerations.

SDO:

IEC

Language:

English

ICS Codes:

31.180

Status:

Withdrawn

Publish date:

1998-04-28

Standard Number:

IEC 61188-1-2:1998