IEC 60749-20:2002

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat

Applies to semiconductor devices (discrete devices and integrated circuits) - and provides a means of assessing the resistance to soldering heat of plastic-encapsulated surface mount devices. The contents of the corrigendum of August 2003 have been included in this copy.

SDO:

IEC

Language:

English

ICS Codes:

31.080.01

Status:

Revised

Publish date:

2002-09-29

Standard Number:

IEC 60749-20:2002