Ergonomics — Recovery model for cyclical industrial work
This document establishes an ergonomic model for any cyclical human work planned and executed in an industrial competitive environment. It also covers the process of measuring work based on the concept of normal work performance and of the assessment of risk factors commonly associated with body postures, body or hand forces, manual material handling of loads and handling low loads at high…
This document gives the safety requirements and measures for horizontal beam panel circular sawing machines with the saw carriage of the front cutting line mounted below the workpiece support, which are manually and/or powered loaded and manually unloaded, capable of continuous production use, as defined in 3.1 and hereinafter referred to as “machines”.
This document deals with all significant…
Clinical laboratory testing and in vitro diagnostic test systems — Broth micro-dilution reference me...
This document describes a method for testing the susceptibility to antifungal agents of yeasts, including Candida spp. and Cryptococcus neoformans, that cause infections. The reference method described here has not been used in studies of the yeast forms of dimorphic fungi, such as Blastomyces dermatitidis and/or Histoplasma capsulatum variety capsulatum. Moreover, testing filamentous fungi (…
Specification and qualification of welding procedures for metallic materials — Welding procedure tes...
This document specifies the tests which can be used for qualification of welding procedure specifications for spot, seam, and projection welding processes.
NOTE The procedures are written for embossed projection welding. They can be adapted for solid projections as well, e.g. nut welding, stud welding. cross wire welding.
This document defines the conditions for carrying out tests and the…
Printed electronics - Part 201-2: Materials - Substrates - Measurement methods for properties of str...
IEC 62899-201-2:2021(E) defines measurement methods for the properties of stretchable substrates, in order to use evaluating stretchable functional layers (conductive, semiconducting, and insulating) formed by printing technologies. If the same types of materials as the substrates are used for the cover lay film, they are also subjected to the measurement defined in this document.
Stretchable…
Gas cylinders — Ball valves — Specification and testing
This document specifies design, type testing, marking, manufacturing tests and examinations requirements for ball valves used as:
closures of refillable transportable gas cylinders, pressure drums and tubes;
main valves for cylinder bundles;
valves for cargo transport units [e.g. trailers, battery vehicles, multi-element gas containers (MEGCs)];
which convey compressed gases, liquefied gases…
Communication networks and systems for power utility automation - Part 7-420: Basic communication st...
IEC 61850-7-420:2021 defines the IEC 61850 information models to be used in the exchange of information with distributed energy resources (DER) and Distribution Automation (DA) systems. DERs include distribution-connected generation systems, energy storage systems, and controllable loads, as well as facility DER management systems, including aggregated DER, such as plant control systems, facility…
Integrated optics — Vocabulary — Part 1: Optical waveguide basic terms and symbols
This document defines basic terms for integrated optical devices, their related optical chips and optical elements which find applications, for example, in the fields of optical communications and sensors.
— The coordinate system used in Clause 3 is described in Annex A.
— The symbols and units defined in detail in Clause 3 are listed in Annex B.
Integrated optics — Interfaces — Parameters relevant to coupling properties
This document defines the relevant properties for coupling lightwaves into and out of integrated optical chips (IOC) and chips with photonic integrated circuits (PIC). This document mainly focuses on butt coupling via the waveguide endfaces. The definitions provide the basis for specifying the elements to be coupled (e. g. fibres, integrated optical chips) related to coupling properties.
