Cards and security devices for personal identification — Test methods — Part 6: Contactless proximi...
The ISO/IEC 10373 series defines test methods for characteristics of identification cards according to the definition given in ISO/IEC 7810. Each test method is cross‑referenced to one or more base standards, which can be ISO/IEC 7810 or one or more of the supplementary standards that define the information storage technologies employed in identification card applications.
NOTE 1 Criteria for…
Cards and security devices for personal identification - Test methods - Part 6: Contactless proximi...
The ISO/IEC 10373 series defines test methods for characteristics of identification cards according to the definition given in ISO/IEC 7810. Each test method is cross‑referenced to one or more base standards, which can be ISO/IEC 7810 or one or more of the supplementary standards that define the information storage technologies employed in identification card applications.
NOTE 1 Criteria for…
Thermoplastics piping systems for underground non-pressure applications — Test method for leaktightn...
This document specifies a test method for determining the leaktightness of elastomeric sealing ring type joints for buried thermoplastics non-pressure piping systems.
Unless otherwise specified in the referring standard, the tests are carried out at the following basic test pressures:
— p1: internal negative air pressure (partial vacuum);
— p2: a low internal hydrostatic pressure;
—…
Junction boxes for photovoltaic modules - Safety requirements and tests
IEC 62790:2020 is available as IEC 62790:2020 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 62790:2020 describes safety requirements, constructional requirements and tests for junction boxes up to 1 500 V DC for use on photovoltaic modules in accordance with class II of IEC 61140:2016.…
Junction boxes for photovoltaic modules - Safety requirements and tests
IEC 62790:2020 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition.
IEC 62790:2020 describes safety requirements, constructional requirements and tests for junction boxes up to 1 500 V DC…
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temp...
IEC 60749-15:2020 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition.
IEC 60749-15:2020 describes a test used to determine whether encapsulated solid state devices used for through-hole…
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temp...
IEC 60749-15:2020 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering. In order to establish a standard test procedure for the most reproducible methods, the solder dip method is used because of its more…
IEC 62541-6:2020 is available as IEC 62541-6:2020 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 62541-6:2020 specifies the OPC Unified Architecture (OPC UA) mapping between the security model described in IEC TR 62541-2, the abstract service definitions specified in IEC 62541-4, the…
IEC 62541-6:2020 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition.
IEC 62541-6:2020 specifies the OPC Unified Architecture (OPC UA) mapping between the security model described in IEC TR…
IEC 62541-4:2020 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition.
IEC 62541-4:2020 defines the OPC Unified Architecture (OPC UA) Services. The Services defined are the collection of…
